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RURG8060_F085 - onsemi

Description: Fairchild RURG8060_F085, Diode, 600V 80A, 90ns, 2-Pin TO-247

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PCB Footprints
RURG8060_F085 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-2L2
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3D Models
RURG8060_F085 - onsemi  - 3D model - Transistor Outline, Vertical - TO-247-2L2
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RURG8060_F085 Details

  • Manufacturer Part Number:

    RURG8060_F085

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    R-PSFM-T2

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    59 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.6 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    240 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    80 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    250 µA

  • Reverse Recovery Time-Max:

    0.09 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RURG8060_F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1 oz copper thickness and a 1-inch square copper pour on the bottom layer for heat dissipation.
  • Implement a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power handling at high temperatures. Monitor the device's junction temperature and adjust the operating conditions accordingly.
  • Use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste and use a reflow oven with a peak temperature of 240°C to 250°C. Avoid overheating and ensure a smooth, even solder flow.
  • Handle the device in an ESD-controlled environment, use ESD-protective packaging, and ground yourself before handling the device. Implement ESD protection circuits and follow proper PCB design guidelines to minimize ESD risks.
  • Store the device in its original packaging, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the leads or die. Use anti-static wrist straps and mats when handling the device.

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RURG8060_F085 Overview

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