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RURP1560 - onsemi

Description: RURP1560, Rectifier Diode, Switching 15A max, 600V, 2-Pin, TO-220AC

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PCB Footprints
RURP1560 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 2L
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3D Models
RURP1560 - onsemi  - 3D model - Transistor Outline, Vertical - TO-220 2L
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RURP1560 Details

  • Manufacturer Part Number:

    RURP1560

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-2

  • Package Description:

    ROHS COMPLIANT, TO-220AC, 2 PIN

  • Manufacturer Package Code:

    340BA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    100 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.06 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RURP1560 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a proper heat sink design, ensure good airflow, and consider using a thermal interface material (TIM) to reduce thermal resistance. Monitor the device's junction temperature (Tj) and adjust the system design accordingly.
  • Use a soldering temperature of 250°C (max) with a dwell time of 3-5 seconds. Ensure a soldering iron with a temperature-controlled tip and a solder with a melting point above 217°C.
  • Use an ESD wrist strap or mat, and ensure all equipment is grounded. Handle the device by the body or pins, avoiding direct contact with the die. Use ESD-sensitive packaging and storage materials.
  • Store the device in a dry, cool place (20°C to 30°C) with relative humidity below 60%. Avoid exposure to direct sunlight, moisture, and contaminants.

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RURP1560 Overview

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