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RURP8100 - onsemi

Description: Obsolete - 8A, 600V, Ultrafast Diode

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PCB Footprints
RURP8100 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 2L_1
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3D Models
RURP8100 - onsemi  - 3D model - Transistor Outline, Vertical - TO-220 2L_1
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RURP8100 Details

  • Manufacturer Part Number:

    RURP8100

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-2

  • Package Description:

    TO-220AC, 2 PIN

  • Manufacturer Package Code:

    340BA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Breakdown Voltage-Min:

    1000 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    75 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.1 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RURP8100 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a heat sink with a thermal interface material, ensure good airflow, and consider using a thermal shield or heat spreader. Monitor junction temperature and adjust the design accordingly.
  • Focus on the input filter design, ensuring a common-mode choke with a high impedance at the switching frequency, and a differential-mode filter with a low-pass characteristic.
  • Use a low-dropout linear regulator for the standby voltage, minimize the number of active components, and consider using a low-power mode or shutdown feature.
  • Implement a voltage monitor with a precise threshold, use a fast-acting OVP circuit, and consider adding a soft-start feature to prevent inrush currents.

Trust Checks

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RURP8100 Overview

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Part Image RURP8100_NL Fairchild Semiconductor Corporation

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