RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad, and a minimum of 2oz copper thickness. A thermal via array under the module can also improve heat dissipation.
Yes, the RW-0505S is designed to withstand vibrations up to 10G peak acceleration, but it's recommended to follow RECOM's guidelines for mechanical fixation and to perform additional vibration testing for specific applications.
RECOM recommends derating the output power by 2.5% per degree Celsius above 40°C, and ensuring good airflow around the module. Additionally, using a heat sink or thermal interface material can help improve thermal performance.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, and a voltage rating of at least 50V. The capacitor should be placed as close as possible to the module's input pins.
Yes, but it's recommended to follow RECOM's guidelines for paralleling, including using identical modules, ensuring identical input and output connections, and providing adequate heat sinking and thermal management.
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RW-0505S Overview
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