RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
To ensure reliability in high-temperature environments, RECOM recommends derating the output power according to the temperature derating curve provided in the datasheet. Additionally, ensuring good airflow and using a heat sink or metal plate to dissipate heat can help reduce the module's temperature.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF and a voltage rating of at least 50 V. The capacitor should be placed as close as possible to the input pins of the module to minimize noise and ripple.
Yes, the RW2-1212D/H2/SMD can be used in a redundant or parallel configuration, but RECOM recommends consulting with their application engineers to ensure proper design and implementation. Additionally, the modules should be synchronized to prevent oscillation and ensure stable operation.
According to RECOM, the typical MTBF of the RW2-1212D/H2/SMD is >1.5 million hours at 40°C ambient temperature, calculated according to MIL-HDBK-217F.
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