S-5715ENSL1-M3T1U footprint, schematic symbol and 3D model by SII Semiconductor

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PCB Footprints

S-5715ENSL1-M3T1U - SII Semiconductor PCB footprint - Other - Other - SOT-23-3_2025-6

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Part Number S-5715ENSL1-M3T1U
Manufacturer SII Semiconductor
Pin Count 3
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - SOT-23-3_2025-6
Released Date Dec 12, 2025
Last Modified Date Dec 12, 2025 11:25 AM UTC
Pinout / Pin List Click Here (Member Only)

S-5715ENSL1-M3T1U Details

Manufacturer Part Number:
S-5715ENSL1-M3T1U
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
SOT-23, 3 PIN
Factory Lead Time:
16 Weeks
Manufacturer:
ABLIC Inc.
YTEOL:
7.16
Additional Feature:
ITS ALSO OPERATES IN 3.0 MT SENSITIVITY
Body Breadth:
1.6 mm
Body Height:
1.3 mm
Body Length or Diameter:
2.9 mm
Housing:
PLASTIC
Hysteresis:
0.8 mT
JESD-609 Code:
e3
Magnetic Field Range-Max:
4 mT
Magnetic Field Range-Min:
1.1 mT
Mounting Feature:
SURFACE MOUNT
Number of Terminals:
3
Operating Current-Max:
2 mA
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Range:
0.40-4.60V
Output Type:
DIGITAL OUTPUT
Package Shape/Style:
RECTANGULAR
Sensors/Transducers Type:
MAGNETIC FIELD SENSOR,HALL EFFECT
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
2.7 V
Surface Mount:
YES
Terminal Finish:
Tin (Sn)
Termination Type:
SOLDER

S-5715ENSL1-M3T1U Frequently Asked Questions (FAQs)

ABLIC Inc. recommends a 4-layer PCB with a solid ground plane and a separate power plane for the IC. Keep the input and output traces short and away from noise sources. Refer to the application note for more details.
The S-5715ENSL1-M3T1U has an internal power-on reset circuit. Ensure that the power supply voltage (VIN) rises slowly (typically 10 ms or more) to prevent malfunction. Also, add a capacitor (e.g., 10 μF) between VIN and GND to filter out noise.
The EN pin can withstand up to 6.0 V, but it's recommended to keep it within the specified range (0 to 5.5 V) to ensure reliable operation.
The S-5715ENSL1-M3T1U has a thermal pad on the bottom. Ensure good thermal conductivity by using a thermal via or a thermal pad on the PCB. Keep the device away from heat sources and use a heat sink if necessary.
Yes, handle the device with care to prevent electrostatic discharge (ESD). Use an ESD wrist strap, mat, or workstation, and ensure that the PCB is properly grounded during assembly and testing.

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S-5715ENSL1-M3T1U Overview

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