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S-8110 - Nidec Copal

Description: Coded Rotary Switches rotary code octal, w/knob, real code, top adj.

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PCB Footprints
S-8110 - Nidec Copal PCB footprint - Other - Other - S-8110-2
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3D Models
S-8110 - Nidec Copal  - 3D model - Other - S-8110-2
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S-8110 Details

  • Manufacturer Part Number:

    S-8110

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.50.90.20

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Nidec Copal Electronics Corporation

  • YTEOL:

    9

  • Actuator Length:

    0.236 inch

  • Actuator Type:

    KNOB TYPE

  • Additional Feature:

    APPROVAL: UL

  • Body Breadth:

    7.2 mm

  • Body Height:

    3.9 mm

  • Body Length or Diameter:

    7.2 mm

  • Center Contact Material:

    COPPER ALLOY

  • Center Contact Plating:

    GOLD

  • Contact Current(DC)-Max:

    0.1 A

  • Contact (DC) Max Rating R Load:

    0.1A@5VDC

  • Contact Resistance:

    0.1 mΩ

  • Contact Voltage(DC)-Max:

    5 V

  • Dielectric Withstand Volts:

    250VAC V

  • Electrical Life:

    10000 Cycle(s)

  • End Contact Material:

    COPPER ALLOY

  • End Contact Plating:

    GOLD

  • Housing Material:

    POLYBUTYLENE TEREPHTHALATE

  • Indexing Angle:

    45 deg

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Material:

    POLYBUTYLENE TEREPHTHALATE

  • JESD-609 Code:

    e4

  • Mounting Feature:

    THROUGH HOLE-STRAIGHT

  • Number of Positions:

    8

  • Number of Switch Sections:

    1

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -25 °C

  • PCB Hole Count:

    4

  • Packing Method:

    BAG

  • Solderability:

    HAND/REFLOW

  • Surface Mount:

    NO

  • Switch Action:

    LATCHED

  • Switch Function:

    BINARY CODED OCTAL

  • Switch Type:

    ROTARY CODED SWITCH

  • Terminal Finish:

    Gold (Au)

  • Terminal Length:

    1.594 inch

  • Terminal Material:

    COPPER ALLOY

  • Termination Type:

    SOLDER

S-8110 Frequently Asked Questions (FAQs)

  • A recommended PCB layout is to keep the input and output pins as close as possible to the device, and to use a solid ground plane to reduce noise and electromagnetic interference (EMI). Additionally, it's recommended to use a 10uF capacitor between the VIN and GND pins to filter out noise.
  • To ensure proper thermal management, it's recommended to attach a heat sink to the device, especially in high-power applications. The heat sink should be designed to dissipate heat efficiently, and thermal interface material (TIM) should be used to fill any gaps between the device and heat sink. Additionally, ensure good airflow around the device to prevent overheating.
  • The maximum allowable voltage drop across the S-8110 is typically around 1.5V to 2V, depending on the specific application and operating conditions. Exceeding this voltage drop may result in reduced performance, increased heat generation, or even device failure.
  • The S-8110 is rated for operation up to 125°C, but it's recommended to derate the device's performance and power handling at higher temperatures to ensure reliability and prevent overheating. Consult the datasheet and application notes for specific guidance on high-temperature operation.
  • To troubleshoot issues with the S-8110, start by verifying the input voltage, output load, and ambient temperature are within the recommended specifications. Check for proper PCB layout, thermal management, and decoupling capacitors. Use an oscilloscope to monitor the output voltage and current, and consult the datasheet and application notes for guidance on troubleshooting specific issues.

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S-8110 Overview

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