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S11108 - Hamamatsu

Description: IMAGE SENSOR, 14UM X 14UM 5V Single Power Supply

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PCB Footprints
S11108 - Hamamatsu PCB footprint - Other - Other - S11108-2
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3D Models
S11108 - Hamamatsu  - 3D model - Other - S11108-2
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S11108 Details

  • Manufacturer Part Number:

    S11108

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan

  • Manufacturer:

    Hamamatsu Photonics

  • YTEOL:

    6

  • Additional Feature:

    IT ALSO HAVE A DYNAMIC RANGE OF 66 DB

  • Array Type:

    LINEAR

  • Body Breadth:

    10.02 mm

  • Body Height:

    3 mm

  • Body Length or Diameter:

    41.6 mm

  • Data Rate:

    10 Mbps

  • Dynamic Range:

    72.04 dB

  • Horizontal Pixel:

    2048

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Operating Current-Max:

    50 mA

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    DIGITAL VOLTAGE

  • Package Shape/Style:

    RECTANGULAR

  • Pixel Size:

    14X14 µm

  • Sensitivity (V/lx.s):

    50 V/lx.s

  • Sensors/Transducers Type:

    IMAGE SENSOR,CMOS

  • Spectral Response (nm):

    400-1000

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Surface Mount:

    NO

  • Termination Type:

    SOLDER

  • Vertical Pixel:

    1

S11108 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the S11108 is -20°C to 70°C. However, it's essential to note that the device's performance may degrade at extreme temperatures.
  • To prevent damage, store the S11108 in a dry, clean environment away from direct sunlight and moisture. During transportation, ensure the device is securely packaged to prevent mechanical shock and vibration.
  • The recommended soldering temperature is 260°C (500°F) for 10 seconds or less. Exceeding this temperature or time may damage the device.
  • While the S11108 is designed to operate in a normal humidity range, it's not recommended for use in extremely humid environments. If you must use it in a humid environment, ensure proper sealing and protection to prevent moisture ingress.
  • Use a soft, dry brush or a lint-free cloth to gently remove any debris or contaminants from the device. Avoid using chemicals, solvents, or ultrasonic cleaners, as they may damage the device.

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S11108 Overview

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