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S1A - Multicomp Pro

Description: MULTICOMP - S1A - DIODE, STANDARD, 1A, 50V, SMD

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PCB Footprints
S1A - Multicomp Pro PCB footprint - Diodes Moulded - Diodes Moulded - SMA/DO-214AC
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3D Models
S1A - Multicomp Pro  - 3D model - Diodes Moulded - SMA/DO-214AC
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S1A Details

  • Manufacturer Part Number:

    S1A

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AC

  • Package Description:

    PLASTIC, SMA, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    6.07

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Recovery Time-Max:

    1.8 µs

  • Surface Mount:

    YES

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

S1A Frequently Asked Questions (FAQs)

  • The recommended PCB layout for S1A involves placing the device near the power source, using a solid ground plane, and keeping the input and output traces separate. For thermal management, a heat sink with a thermal resistance of 10°C/W or lower is recommended, and the device should be mounted on a PCB with a thermal conductivity of 1 W/m-K or higher.
  • To ensure reliability and longevity in high-temperature applications, it's essential to follow the recommended operating temperature range, use a suitable heat sink, and ensure good airflow around the device. Additionally, derating the output current and voltage can help reduce thermal stress and increase the lifespan of the device.
  • To minimize electromagnetic interference, it's recommended to use a shielded enclosure, keep the input and output cables separate, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensuring good PCB layout and grounding practices, such as using a solid ground plane and minimizing loop areas, can help reduce EMI.
  • Yes, S1A can be used in parallel or series configurations to increase power output or input voltage. However, it's essential to ensure that the devices are properly synchronized and matched to avoid oscillations and uneven current sharing. Additionally, the user should carefully evaluate the thermal and electrical stresses on the devices in these configurations.
  • When working with S1A, it's essential to follow proper safety precautions, such as wearing protective gear, ensuring a safe working environment, and avoiding electrical shock hazards. Additionally, the user should follow the recommended handling and storage procedures to prevent damage to the device.

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S1A Overview

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