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S1B-13-F - Diodes Incorporated

Description: Diodes Inc S1B-13-F Switching Diode, 1A 100V, 2-Pin SMA

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S1B-13-F - Diodes Incorporated PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - S1B-13-F
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S1B-13-F - Diodes Incorporated  - 3D model - Diodes Moulded Non Polarised - S1B-13-F
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S1B-13-F Details

  • Manufacturer Part Number:

    S1B-13-F

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SMA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Recovery Time-Max:

    3 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

S1B-13-F Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the S1B-13-F is a standard SOD-123 package footprint with a minimum pad size of 0.8mm x 0.8mm and a thermal pad size of 1.5mm x 1.5mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum operating temperature range for the S1B-13-F is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • Yes, the S1B-13-F is suitable for high-reliability applications due to its robust design and manufacturing process. However, it's essential to follow proper design and assembly guidelines to ensure the component's reliability.
  • Store the S1B-13-F in its original packaging or an equivalent ESD-protective package, and avoid exposing it to moisture, extreme temperatures, or physical stress during shipping and storage.

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S1B-13-F Overview

Use the download button to access the S1B-13-F schematic symbol, PCB footprint, and 3D model.
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For a full list of alternate parts for S1B-13-F, check out Findchips.com