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S1GHM2G - Taiwan Semiconductor

Description: Rectifiers 1A 400V Standard Rec overy Rectifier

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Symbol
S1GHM2G - Taiwan Semiconductor - PCB symbol
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PCB Footprints
S1GHM2G - Taiwan Semiconductor PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AC (SMA)
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3D Models
S1GHM2G - Taiwan Semiconductor - 3D model - Diodes Moulded - DO-214AC (SMA)
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S1GHM2G Details

  • Manufacturer Part Number:

    S1GHM2G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    0

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Recovery Time-Max:

    1.5 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

S1GHM2G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and crosstalk.
  • Use a thermal pad or a heat sink with a thermal interface material to dissipate heat. Ensure good airflow around the device and avoid blocking the thermal pad. A thermal resistance of <1°C/W is recommended.
  • The maximum operating frequency is 2.7 GHz, but it can be overclocked up to 3.2 GHz with proper cooling and power management. However, this may void the warranty and affect the device's reliability.
  • Use the power-saving features like dynamic voltage and frequency scaling, and clock gating. Optimize the firmware to minimize idle time and use low-power modes when possible. Use a power-efficient PCB design and component selection.
  • Use 10uF to 22uF ceramic capacitors with a voltage rating of 2.5V to 3.3V, and an ESR of <1 ohm. Place them as close as possible to the power pins, and use multiple capacitors in parallel to reduce the overall ESR.

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S1GHM2G Overview

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S1GHM2G Alternates

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For a full list of alternate parts for S1GHM2G, check out Findchips.com