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S1JFL - onsemi

Description: Ultra Thin Profile – Maximum Height of 1.08 mm; MSL level 1; Glass Passivated Junction; UL Flammability 94V-0 Classification; RoHS Compliant / Green Mold Compound

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PCB Footprints
S1JFL - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD123FL
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3D Models
S1JFL - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD123FL
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S1JFL Details

  • Manufacturer Part Number:

    S1JFL

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    600 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    2 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

S1JFL Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the junction temperature and adjust the operating conditions accordingly.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may damage the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines. Follow proper PCB design and handling practices to minimize ESD risks.
  • Power up the VCC pin first, followed by the input signals. Ensure that the input signals are stable before applying VCC.

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S1JFL Overview

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