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S25FL128SAGBHVB00 - Infineon

Description: FLASH - NOR Memory IC 128Mbit SPI - Quad I/O 133 MHz 24-BGA (6x8), 2.7V ~ 3.6V , -40°C ~ 105°C (TA)

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PCB Footprints
S25FL128SAGBHVB00 - Infineon PCB footprint - BGA - BGA - PG-TFBGA-24
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3D Models
S25FL128SAGBHVB00 - Infineon  - 3D model - BGA - PG-TFBGA-24
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S25FL128SAGBHVB00 Details

  • Manufacturer Part Number:

    S25FL128SAGBHVB00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Memory IC Type:

    FLASH

  • Qualification Status:

    Not Qualified

S25FL128SAGBHVB00 Frequently Asked Questions (FAQs)

  • The S25FL128SAGBHVB00 has an operating temperature range of -40°C to +85°C, with an extended temperature range of -40°C to +105°C for industrial grade devices.
  • The HOLD# pin should be pulled high during power-up and power-down to prevent unwanted writes or erases. It's recommended to connect a pull-up resistor to VCC and a capacitor to GND to ensure a clean signal.
  • The S25FL128SAGBHVB00 supports clock frequencies up to 104 MHz, but it's recommended to use a clock frequency of 50 MHz or lower for reliable operation.
  • The WP# pin is used to protect the status register and the block protection bits. When WP# is low, the status register and block protection bits are write-protected. When WP# is high, the status register and block protection bits can be written.
  • The DPD mode is used to reduce power consumption when the device is not in use. In DPD mode, the device consumes very low power (typically < 1 μA) and can be used to extend battery life in portable applications.

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