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S25FL128SAGMFB000 - Infineon

Description: NOR Flash Nor

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S25FL128SAGMFB000 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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3D Models
S25FL128SAGMFB000 - Infineon  - 3D model - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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S25FL128SAGMFB000 Details

  • Manufacturer Part Number:

    S25FL128SAGMFB000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Memory IC Type:

    FLASH

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Technology:

    65 nm

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    30

S25FL128SAGMFB000 Frequently Asked Questions (FAQs)

  • The S25FL128SAGMFB000 can operate from -40°C to +125°C, with a typical operating temperature range of -25°C to +85°C.
  • The HOLD# pin should be pulled high during power-up and power-down to prevent any unwanted commands from being executed. It's recommended to connect a pull-up resistor to VCC.
  • The recommended clock frequency for the SPI interface is up to 104 MHz, but it can operate at frequencies up to 120 MHz with some limitations.
  • The WP# pin is an active low input that prevents writing to the status register when low. It's recommended to connect a pull-up resistor to VCC to enable writing to the status register.
  • The S25FL128SAGMFB000 has a minimum erase cycle endurance of 100,000 cycles, with a typical value of 200,000 cycles.

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S25FL128SAGMFB000 Overview

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Part Image S25FL128SAGMFM003 Cypress Semiconductor

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Part Image S25FL128SAGMFB000 Cypress Semiconductor

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For a full list of alternate parts for S25FL128SAGMFB000, check out Findchips.com