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S25FL256SAGBHBA00 - Infineon

Description: NOR Flash Nor

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S25FL256SAGBHBA00 - Infineon PCB footprint - BGA - BGA - FAC024 24-Ball BGA
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S25FL256SAGBHBA00 - Infineon  - 3D model - BGA - FAC024 24-Ball BGA
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S25FL256SAGBHBA00 Details

  • Manufacturer Part Number:

    S25FL256SAGBHBA00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Additional Feature:

    ALSO CONFIGURABLE AS 256M X 1

  • Alternate Memory Width:

    2

  • Clock Frequency-Max (fCLK):

    133 MHz

  • JESD-30 Code:

    R-PBGA-B24

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    33554432 words

  • Number of Words Code:

    32000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Type:

    NOR TYPE

  • Width:

    6 mm

  • Write Cycle Time-Max (tWC):

    500 ms

S25FL256SAGBHBA00 Frequently Asked Questions (FAQs)

  • The S25FL256SAGBHBA00 has an operating temperature range of -40°C to +85°C, with an extended temperature range of -40°C to +105°C for industrial grade devices.
  • The HOLD# pin should be pulled high during power-up and power-down to prevent unwanted commands from being executed. It's recommended to connect a pull-up resistor to VCC and a capacitor to GND to ensure a clean signal.
  • The S25FL256SAGBHBA00 supports clock frequencies up to 104 MHz, but it's recommended to use a clock frequency of 50 MHz or lower to ensure reliable operation and minimize power consumption.
  • The WP# pin is used to protect the status register and the first 256 bytes of the memory array from being written. To enable write protection, connect WP# to VCC. To disable write protection, connect WP# to GND.
  • The DPD mode is a low-power state that reduces the device's power consumption to a minimum. It's useful for battery-powered devices or applications where power consumption needs to be minimized. The device can be awakened from DPD mode by driving the CS# pin low.

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Flash, 32MX8, PBGA24