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S25FL256SAGMFIR00 - Infineon

Description: NOR Flash 256Mb, 3V, 133Mhz SPI NOR Flash

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S25FL256SAGMFIR00 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead SOIC
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S25FL256SAGMFIR00 - Infineon  - 3D model - Small Outline Packages - 16-Lead SOIC
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S25FL256SAGMFIR00 Details

  • Manufacturer Part Number:

    S25FL256SAGMFIR00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Additional Feature:

    IT ALSO CONFIGURED AS 256M X 1

  • Alternate Memory Width:

    2

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Words:

    33554432 words

  • Number of Words Code:

    32000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.0001 A

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    7.5 mm

  • Write Cycle Time-Max (tWC):

    500 ms

  • Write Protection:

    HARDWARE/SOFTWARE

S25FL256SAGMFIR00 Frequently Asked Questions (FAQs)

  • The S25FL256SAGMFIR00 has an operating temperature range of -40°C to +85°C.
  • The HOLD# signal should be asserted low to pause the current operation, and de-asserted high to resume the operation.
  • The WP# pin is used to prevent accidental writes to the device. When WP# is low, the device is write-protected.
  • To perform a sector erase, send the Sector Erase command (0x20) followed by the sector address. The device will then erase the specified sector.
  • The recommended power-up sequence is to apply VCC first, followed by VPP (if used), and then the clock signal.

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S25FL256SAGMFIR00 Overview

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Part Image S25FL256SAGMFIR00 Spansion

Flash, 32MX8, PDSO16