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S25FL512SAGBHMC13 - Infineon

Description: CMOS 3.0 V Core with versatile I/O • SPI with Multi-I/O Density 512 Mb (64 MB)

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PCB Footprints
S25FL512SAGBHMC13 - Infineon PCB footprint - BGA - BGA - 24-ball BGA, 4 × 6 ball footprint (FAC024), top view[42]..........
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3D Models
S25FL512SAGBHMC13 - Infineon  - 3D model - BGA - 24-ball BGA, 4 × 6 ball footprint (FAC024), top view[42]..........
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S25FL512SAGBHMC13 Details

  • Manufacturer Part Number:

    S25FL512SAGBHMC13

  • Manufacturer:

    Infineon Technologies AG

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