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S25FL512SAGBHVA10 - Infineon

Description: NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 512M-bit 512M/256M/128M x 1/2-bit/4-bit 14.5ns 24-Pin BGA Tray

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PCB Footprints
S25FL512SAGBHVA10 - Infineon PCB footprint - BGA - BGA - Ball Grid Array 24-Ball 6x8 mm (FAB024)_2021
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3D Models
S25FL512SAGBHVA10 - Infineon  - 3D model - BGA - Ball Grid Array 24-Ball 6x8 mm (FAB024)_2021
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S25FL512SAGBHVA10 Details

  • Manufacturer Part Number:

    S25FL512SAGBHVA10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Memory IC Type:

    FLASH

  • Moisture Sensitivity Level:

    3

  • Qualification Status:

    Not Qualified

  • Technology:

    65 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

S25FL512SAGBHVA10 Frequently Asked Questions (FAQs)

  • The S25FL512SAGBHVA10 has an operating temperature range of -40°C to +125°C, making it suitable for use in a wide range of applications.
  • The S25FL512SAGBHVA10 is rated for a minimum of 100,000 erase cycles, making it suitable for applications that require frequent data updates.
  • The typical programming time for the S25FL512SAGBHVA10 is around 3-5 milliseconds per 256-byte page, depending on the operating conditions and programming method used.
  • Yes, the S25FL512SAGBHVA10 supports simultaneous read and write operations, allowing for improved system performance and efficiency.

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S25FL512SAGBHVA10 Overview

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