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S25FL512SAGMFI011 - Infineon

Description: Flash,512Mbit,QSPI,133MHz,3V,SOIC16 S25FL512SAGMFI011, SPI NOR Flash Memory, 128M x 4 bit, 256M x 2 bit, 512M x 1 bit 512Mbit, 2.7 → 3.6 V, 16-Pin

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PCB Footprints
S25FL512SAGMFI011 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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3D Models
S25FL512SAGMFI011 - Infineon  - 3D model - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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S25FL512SAGMFI011 Details

  • Manufacturer Part Number:

    S25FL512SAGMFI011

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Memory IC Type:

    FLASH

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Technology:

    65 nm

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    30

S25FL512SAGMFI011 Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the S25FL512SAGMFI011 is 104 MHz.
  • The S25FL512SAGMFI011 can endure up to 100,000 program/erase cycles before it starts to degrade.
  • The S25FL512SAGMFI011 has a data retention period of at least 20 years at a temperature of 25°C.
  • Yes, the S25FL512SAGMFI011 is compatible with the SPI protocol, as well as other protocols such as Dual SPI and Quad SPI.
  • The S25FL512SAGMFI011 comes in a 24-ball BGA package.

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S25FL512SAGMFI011 Overview

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Part Image S25FL512SAGMFV013 Cypress Semiconductor

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