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S25FL512SAGMFMG13 - Infineon

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S25FL512SAGMFMG13 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 16 lead, 300-mil body width
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3D Models
S25FL512SAGMFMG13 - Infineon  - 3D model - Small Outline Packages - SOIC 16 lead, 300-mil body width
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S25FL512SAGMFMG13 Details

  • Manufacturer Part Number:

    S25FL512SAGMFMG13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Memory IC Type:

    FLASH

S25FL512SAGMFMG13 Frequently Asked Questions (FAQs)

  • The S25FL512SAGMFMG13 has an operating temperature range of -40°C to +125°C, making it suitable for industrial and automotive applications.
  • The S25FL512SAGMFMG13 has a minimum of 100,000 erase cycles per sector, and 10,000 erase cycles per block, making it suitable for applications that require frequent data updates.
  • The typical programming time for the S25FL512SAGMFMG13 is around 2-3 ms per page (256 bytes), and around 30-40 ms per block (64 KB).
  • Yes, the S25FL512SAGMFMG13 supports simultaneous read and write operations, allowing for improved system performance and efficiency.
  • The WP# (Write Protect) pin is used to prevent accidental writes to the device. When the WP# pin is low, the device is in write-protect mode, and no writes are allowed.

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