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S25FL512SAGMFVG10 - Infineon

Description: 512 Mb (64 MB) FL-S Flash SPI Multi-I/O, 3.0 V

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S25FL512SAGMFVG10 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-16_2024
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3D Models
S25FL512SAGMFVG10 - Infineon  - 3D model - Small Outline Packages - PG-DSO-16_2024
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S25FL512SAGMFVG10 Details

  • Manufacturer Part Number:

    S25FL512SAGMFVG10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Memory IC Type:

    FLASH

  • Qualification Status:

    Not Qualified

S25FL512SAGMFVG10 Frequently Asked Questions (FAQs)

  • The S25FL512SAGMFVG10 has an operating temperature range of -40°C to +125°C, making it suitable for industrial and automotive applications.
  • The HOLD# pin should be pulled high during power-up and power-down to prevent unwanted commands from being executed. It's recommended to connect a pull-up resistor to VCC and a capacitor to GND to ensure a clean signal.
  • The S25FL512SAGMFVG10 supports clock frequencies up to 104 MHz, but it's recommended to use a clock frequency of 50 MHz or lower to ensure reliable operation and minimize power consumption.
  • The WP# pin is used to protect the status register and the first 256 bytes of the memory array from being written. To enable write protection, connect WP# to VCC. To disable write protection, connect WP# to GND.
  • The DPD mode is a low-power state that reduces the device's power consumption to a minimum. It's useful for battery-powered devices or applications where power consumption needs to be minimized. However, note that the device will not respond to any commands in DPD mode.

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