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S25FL512SAGMFVG11 - Infineon

Description: NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 512M-bit 512M/256M/128M x 1/2-bit/4-bit 14.5ns 16-Pin SOIC W Tube

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S25FL512SAGMFVG11 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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S25FL512SAGMFVG11 - Infineon  - 3D model - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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S25FL512SAGMFVG11 Details

  • Manufacturer Part Number:

    S25FL512SAGMFVG11

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Memory IC Type:

    FLASH

  • Qualification Status:

    Not Qualified

S25FL512SAGMFVG11 Frequently Asked Questions (FAQs)

  • The S25FL512SAGMFVG11 has an operating temperature range of -40°C to +125°C, making it suitable for industrial and automotive applications.
  • The HOLD# pin should be pulled high during power-up and power-down to prevent any unwanted commands from being executed. It's recommended to connect a pull-up resistor to VCC and a capacitor to GND to ensure a clean signal.
  • The S25FL512SAGMFVG11 supports clock frequencies up to 104 MHz. However, it's recommended to use a clock frequency of 50 MHz or lower for reliable operation.
  • The WP# pin is used to protect the status register from being written. When WP# is low, the status register is write-protected. When WP# is high, the status register can be written. It's recommended to tie WP# to VCC or GND depending on the desired configuration.
  • The DPD mode is used to reduce power consumption when the device is not in use. In DPD mode, the device consumes very low power (typically < 1 μA) and can be used to extend battery life in battery-powered applications.

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