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S25FL512SDPBHVC10 - Infineon

Description: NOR Flash Nor

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PCB Footprints
S25FL512SDPBHVC10 - Infineon PCB footprint - BGA - BGA - Ball Grid Array 24-ball 6 x 8 mm (FAB024)
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3D Models
S25FL512SDPBHVC10 - Infineon  - 3D model - BGA - Ball Grid Array 24-ball 6 x 8 mm (FAB024)
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S25FL512SDPBHVC10 Details

  • Manufacturer Part Number:

    S25FL512SDPBHVC10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Memory IC Type:

    FLASH

  • Qualification Status:

    Not Qualified

S25FL512SDPBHVC10 Frequently Asked Questions (FAQs)

  • The S25FL512SDPBHVC10 has an operating temperature range of -40°C to +125°C, making it suitable for use in a wide range of applications.
  • The HOLD# pin should be pulled high during power-up and power-down to prevent any unwanted commands from being executed. It's recommended to connect a pull-up resistor to VCC to ensure the pin is held high during these transitions.
  • The S25FL512SDPBHVC10 supports clock frequencies up to 104 MHz, but it's recommended to use a clock frequency of 50 MHz or lower to ensure reliable operation and minimize power consumption.
  • The WP# pin is used to protect the status register from being written. When WP# is low, the status register is write-protected. When WP# is high, the status register can be written. It's recommended to tie WP# to VCC or use a pull-up resistor to ensure the status register is not accidentally written.
  • The DPD mode is a low-power state that reduces the device's power consumption to a minimum. It's useful for applications where the device needs to be in a low-power state for an extended period. However, note that the DPD mode can only be exited by a hardware reset or power cycle.

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