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S25HL01GTFABHI030 - Infineon

Description: NOR Flash Nor

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PCB Footprints
S25HL01GTFABHI030 - Infineon PCB footprint - BGA - BGA - 24-ball 8 x 8 mm (VAC024)
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3D Models
S25HL01GTFABHI030 - Infineon  - 3D model - BGA - 24-ball 8 x 8 mm (VAC024)
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S25HL01GTFABHI030 Details

  • Manufacturer Part Number:

    S25HL01GTFABHI030

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    12

  • Clock Frequency-Max (fCLK):

    166 MHz

  • Data Retention Time-Min:

    25

  • Endurance:

    2560000 Write/Erase Cycles

  • JESD-30 Code:

    S-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00056 A

  • Supply Current-Max:

    0.069 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Type:

    NOR TYPE

  • Width:

    8 mm

  • Write Protection:

    HARDWARE

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S25HL01GTFABHI030 Overview

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