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S25HL02GTDPBHB050 - Infineon

Description: 2-Gb (DDP)/4-Gb (QDP), SEMPER™ Flash with Quad SPI 1.8 V, 3.0 V

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PCB Footprints
S25HL02GTDPBHB050 - Infineon PCB footprint - BGA - BGA - 24-ball BGA
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S25HL02GTDPBHB050 - Infineon  - 3D model - BGA - 24-ball BGA
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S25HL02GTDPBHB050 Details

  • Manufacturer Part Number:

    S25HL02GTDPBHB050

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    12

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    25

  • Endurance:

    2560000 Write/Erase Cycles

  • JESD-30 Code:

    S-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000045 A

  • Supply Current-Max:

    0.11 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Type:

    NOR TYPE

  • Width:

    8 mm

  • Write Protection:

    HARDWARE

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S25HL02GTDPBHB050 Overview

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