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S25HL512TDPNHB010 - Infineon

Description: NOR Flash SEMPER

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S25HL512TDPNHB010 - Infineon PCB footprint - Small Outline No-lead - Small Outline No-lead - PG-WSON-8.
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S25HL512TDPNHB010 - Infineon  - 3D model - Small Outline No-lead - PG-WSON-8.
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S25HL512TDPNHB010 Details

  • Manufacturer Part Number:

    S25HL512TDPNHB010

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    12

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    25

  • Endurance:

    1280000 Write/Erase Cycles

  • JESD-30 Code:

    R-XDSO-N8

  • Length:

    8 mm

  • Memory Density:

    536870912 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    67108864 words

  • Number of Words Code:

    64000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    64MX8

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00034 A

  • Supply Current-Max:

    0.069 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE

S25HL512TDPNHB010 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the S25HL512TDPNHB010 is -40°C to +85°C, with a storage temperature range of -65°C to +150°C.
  • The hold pin (HOLD#) should be driven low to pause the current operation and enter a low-power state. When HOLD# is low, the device will ignore any further input signals until HOLD# is driven high again.
  • The write protect pin (WP#) is used to prevent accidental writes to the device. When WP# is driven low, the device will ignore any write commands. To use WP#, connect it to VCC or a pull-up resistor to enable write operations, or connect it to GND or a pull-down resistor to disable write operations.
  • The optimal clock frequency depends on the specific application and system requirements. The S25HL512TDPNHB010 supports clock frequencies up to 133 MHz, but the actual frequency used should be determined by the system's timing requirements and signal integrity considerations.
  • The S25HL512TDPNHB010 is a specific part number with a unique combination of features, such as a 512 Mbit density, 3.0V to 3.6V operating voltage, and a 24-ball BGA package. Other similar devices from Infineon may have different densities, operating voltages, or package options, so it's essential to consult the datasheet and product documentation to ensure the correct part is selected for the application.

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