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S29AL008J70BFI023 - Infineon

Description: NOR Flash Nor

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S29AL008J70BFI023 - Infineon PCB footprint - BGA - BGA - 48-Ball VFBGA -+
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S29AL008J70BFI023 - Infineon  - 3D model - BGA - 48-Ball VFBGA -+
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S29AL008J70BFI023 Details

  • Manufacturer Part Number:

    S29AL008J70BFI023

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Access Time-Max:

    70 ns

  • Additional Feature:

    DATA RETENTION 20 YEARS TYPICAL AVAILABLE

  • Alternate Memory Width:

    8

  • Boot Block:

    BOTTOM

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    8.15 mm

  • Memory Density:

    8388608 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Sectors/Size:

    1,2,1,15

  • Number of Terminals:

    48

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA48,6X8,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3 V

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1 mm

  • Sector Size:

    8K,4K,16K,32K

  • Standby Current-Max:

    0.000005 A

  • Supply Current-Max:

    0.012 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    6.15 mm

S29AL008J70BFI023 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the S29AL008J70BFI023 is -40°C to +85°C, with a maximum junction temperature of +125°C.
  • The HOLD# signal should be asserted low to pause the current operation and enter a low-power state. De-asserting HOLD# resumes the operation. Note that HOLD# should not be asserted during a write operation, as it may cause data corruption.
  • The WP# signal is used to protect the entire memory array or specific sectors from write operations. When WP# is asserted low, the corresponding sectors or the entire memory array are write-protected.
  • The optimal clock frequency depends on the specific application and system requirements. The S29AL008J70BFI023 supports clock frequencies up to 133 MHz, but the actual frequency should be determined based on factors such as system latency, power consumption, and data transfer rates.
  • The recommended power-up sequence is to apply VCC first, followed by VPP (if used), and then the clock signal. This ensures proper initialization and prevents latch-up conditions.

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S29AL008J70BFI023 Overview

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