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S29JL064J55BHI003 - Infineon

Description: Architectural Advantages  Simultaneous Read/Write operations – Data can be continuously read from one bank while executing erase/program functions in another bank – Zero latency between read and write operations  Flexible bank architecture – Read may occur in any of the three banks not being programmed or erased – Four banks may be grouped by customer to achieve desired bank divisions  Boot sectors – Top and bottom boot sectors in the same device – Any combination of sectors can be erased 

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PCB Footprints
S29JL064J55BHI003 - Infineon PCB footprint - BGA - BGA - VBK048—48-Ball Fine-Pitch Ball Grid Array (BGA) 8.15 mm x 6.15 mm
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3D Models
S29JL064J55BHI003 - Infineon  - 3D model - BGA - VBK048—48-Ball Fine-Pitch Ball Grid Array (BGA) 8.15 mm x 6.15 mm
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S29JL064J55BHI003 Details

  • Manufacturer Part Number:

    S29JL064J55BHI003

  • Manufacturer:

    Infineon Technologies AG

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