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S32G274ASBK1VUCT - NXP

Description: S32G274A Arm Cortex-M7 and -A53, HSE w/Prem Security, LLCE, PFE, PCIe, 20x CAN FD, 4x GbE - Vehicle Network Processor

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Symbol
S32G274ASBK1VUCT - NXP - PCB symbol
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PCB Footprints
S32G274ASBK1VUCT - NXP PCB footprint - BGA - BGA - SOT1655-3_2025-2
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3D Models
S32G274ASBK1VUCT - NXP - 3D model - BGA - SOT1655-3_2025-2
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S32G274ASBK1VUCT Details

  • Manufacturer Part Number:

    S32G274ASBK1VUCT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-525

  • Country Of Origin:

    South Korea

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B525

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    525

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA525,23X23,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100; ISO 26262-ASIL D

  • Seated Height-Max:

    2.12 mm

  • Supply Voltage-Max:

    0.87 V

  • Supply Voltage-Min:

    0.72 V

  • Supply Voltage-Nom:

    0.77 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

S32G274ASBK1VUCT Frequently Asked Questions (FAQs)

  • NXP provides a reference design and layout guidelines in the S32G274ASBK1VUCT datasheet and application notes. Additionally, NXP recommends following the JEDEC standards for thermal management and PCB design.
  • Optimizing power consumption requires a combination of hardware and software techniques. NXP provides power management guidelines in the datasheet and application notes, including clock gating, voltage scaling, and sleep modes. Software optimization involves using low-power modes, reducing clock frequencies, and minimizing peripheral usage.
  • The S32G274ASBK1VUCT has built-in security features such as secure boot, hardware-based cryptography, and secure storage. NXP provides documentation and software development kits (SDKs) to help implement these features. Additionally, NXP recommends following industry-standard security protocols and guidelines, such as those from the Automotive Security Research Group (ASRG).
  • NXP provides documentation and guidelines for functional safety and ISO 26262 compliance in the datasheet and application notes. Additionally, NXP recommends following industry-standard safety protocols and guidelines, such as those from the International Electrotechnical Commission (IEC) and the Society of Automotive Engineers (SAE).
  • NXP recommends using the S32 Design Studio, a free integrated development environment (IDE) that provides a comprehensive set of tools for developing, debugging, and testing applications on the S32G274ASBK1VUCT. Additionally, NXP provides software development kits (SDKs) and example code to help get started with development.

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S32G274ASBK1VUCT Overview

Use the download button to access the S32G274ASBK1VUCT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like S32G2, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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