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S32K341EHT0MPBST - NXP

Description: ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit2 160MHz 1MB (1M x 8) FLASH 172-QFP (16x16) , 2.97V ~ 5.5V , -40°C ~ 125°C

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PCB Footprints
S32K341EHT0MPBST - NXP PCB footprint - Other - Other - SOT1940-1_2026-1.21
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3D Models
S32K341EHT0MPBST - NXP  - 3D model - Other - SOT1940-1_2026-1.21
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S32K341EHT0MPBST Details

  • Manufacturer Part Number:

    S32K341EHT0MPBST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HDQFP-172

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G172

  • Length:

    16 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    32

  • Number of External Interrupts:

    32

  • Number of Serial I/Os:

    11

  • Number of Terminals:

    172

  • Number of Timers:

    48

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP172,.75SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    262144

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100; ISO 26262-ASIL D

  • Seated Height-Max:

    1.75 mm

  • Speed:

    160 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    16 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

S32K341EHT0MPBST Frequently Asked Questions (FAQs)

  • The recommended oscillator crystal frequency for the S32K341EHT0MPBST is 16 MHz or 32 kHz, depending on the application requirements.
  • To configure the internal flash memory for optimal performance, set the flash wait states to 2-3 cycles, and use the flash accelerator (FA) module to improve read performance.
  • The maximum operating temperature range for the S32K341EHT0MPBST is -40°C to 125°C, with a junction temperature of up to 150°C.
  • To implement secure boot on the S32K341EHT0MPBST, use the BootROM's secure boot feature, which supports encrypted boot images and secure key storage.
  • The maximum current consumption of the S32K341EHT0MPBST in active mode is approximately 350 mA at 1.2 V and 120 MHz core frequency.

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S32K341EHT0MPBST Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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