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S32K396EHT1MJBST - NXP

Description: ARM Microcontrollers - MCU S32K396 Arm Cortex-M7, 320MHz, 6MB Flash, Motor Control, PWM, CAN-FD, HSE-B, MAPBGA289 - S32K39 MCUs for Electrification

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S32K396EHT1MJBST - NXP - PCB symbol
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PCB Footprints
S32K396EHT1MJBST - NXP PCB footprint - BGA - BGA - SOT1534-4_2025-1
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3D Models
S32K396EHT1MJBST - NXP - 3D model - BGA - SOT1534-4_2025-1
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S32K396EHT1MJBST Details

  • Manufacturer Part Number:

    S32K396EHT1MJBST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MABGA-289

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B289

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    64

  • Number of Terminals:

    289

  • Number of Timers:

    1

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA289,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    819200

  • ROM (words):

    6291456

  • ROM Programmability:

    FLASH

  • Screening Level:

    ISO 26262-ASIL D

  • Seated Height-Max:

    1.52 mm

  • Speed:

    320 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

S32K396EHT1MJBST Frequently Asked Questions (FAQs)

  • NXP provides a PCB layout guide and thermal management guidelines in the S32K396EHT1MJBST application note (AN12144) and the S32K3xx series PCB design guidelines (AN12093). These documents provide detailed recommendations for PCB layout, thermal vias, and heat sink design to ensure optimal performance and thermal management.
  • To optimize power consumption, use the NXP-provided power management APIs and configure the device to use the lowest possible voltage and frequency for the required performance. Additionally, use the device's low-power modes (e.g., Wait, Stop, and VLPS) and optimize the peripheral usage and clock gating. Refer to the S32K396EHT1MJBST reference manual and the NXP power management application note (AN12213) for more information.
  • The recommended oscillator settings and clock configurations are provided in the S32K396EHT1MJBST reference manual and the NXP oscillator configuration application note (AN12145). These documents provide guidance on selecting the optimal oscillator configuration, clock source, and clock frequency for the specific application requirements.
  • To ensure EMC and EMI compliance, follow the NXP-provided EMC and EMI guidelines (AN12214) and the S32K396EHT1MJBST application note (AN12144). These documents provide recommendations for PCB layout, component selection, and shielding to minimize electromagnetic emissions and improve immunity.
  • NXP provides a range of development tools and SDKs for the S32K396EHT1MJBST, including the S32 Design Studio, S32K3xx SDK, and the MCUXpresso IDE. These tools provide a comprehensive development environment for creating, debugging, and optimizing applications on the S32K396EHT1MJBST.

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S32K396EHT1MJBST Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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