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S34ML02G100TFI000 - Spansion

Description: S34ML02G100TFI000,NAND Flash memory 2Gb S34ML02G100TFI000, Parallel NAND Flash Memory, 128M x 16 bit, 256M x 8 bit 2 GByte, 20ns, 2.7 → 3.6 V, 2, 48-Pin

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PCB Footprints
S34ML02G100TFI000 - Spansion PCB footprint - Small Outline Packages - Small Outline Packages - TSOP1 48PIN
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3D Models
S34ML02G100TFI000 - Spansion  - 3D model - Small Outline Packages - TSOP1 48PIN
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S34ML02G100TFI000 Details

  • Manufacturer Part Number:

    S34ML02G100TFI000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, MO-142DDD, TSOP1-48

  • ECCN Code:

    3A991.B.1.A

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Spansion

  • Access Time-Max:

    25 ns

  • Command User Interface:

    YES

  • Common Flash Interface:

    NO

  • Data Polling:

    NO

  • Data Retention Time-Min:

    10

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Sectors/Size:

    2K

  • Number of Terminals:

    48

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Page Size:

    2K words

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3.3 V

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    128K

  • Standby Current-Max:

    0.00001 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Toggle Bit:

    NO

  • Type:

    SLC NAND TYPE

  • Width:

    12 mm

S34ML02G100TFI000 Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the S34ML02G100TFI000 is 2.7V to 3.6V.
  • The hold signal (HOLD) should be asserted by the external device to request access to the bus. The hold acknowledge signal (HLDA) is asserted by the S34ML02G100TFI000 to indicate that the bus has been granted to the external device.
  • The WP pin is used to prevent accidental writes to the memory array. When the WP pin is tied low, the memory array is write-protected.
  • A sector erase operation can be performed by sending the erase command (0x60) followed by the sector address to be erased. The erase operation is internally timed and takes around 2 seconds to complete.
  • The S34ML02G100TFI000 supports up to 100,000 erase cycles per sector.

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Part Image S34ML02G100TFI003 Spansion

Flash, 256MX8, 25ns, PDSO48