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S34ML16G202TFI203 - SkyHigh Memory

Description: 16 Gb, 3 V, 4-bit ECC, x8 I/O, SLC NAND Flash Memory for Embedded

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S34ML16G202TFI203 - SkyHigh Memory PCB footprint - Small Outline Packages - Small Outline Packages - S34ML01G200TFI003
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S34ML16G202TFI203 - SkyHigh Memory  - 3D model - Small Outline Packages - S34ML01G200TFI003
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S34ML16G202TFI203 Details

  • Manufacturer Part Number:

    S34ML16G202TFI203

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    TSOP1-48

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    SkyHigh Memory Limited

  • Command User Interface:

    YES

  • Common Flash Interface:

    NO

  • Data Polling:

    NO

  • Data Retention Time-Min:

    10

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    17179869184 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    2147483648 words

  • Number of Words Code:

    2000000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2GX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.00001 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Type:

    SLC NAND TYPE

  • Width:

    12 mm

S34ML16G202TFI203 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the S34ML16G202TFI203 is -40°C to 85°C, as specified in the datasheet. However, it's recommended to operate within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • To ensure data integrity, it's essential to follow the recommended power-down and power-up sequences outlined in the datasheet. Additionally, consider implementing a voltage supervisor or power-on reset circuit to ensure a clean power-up sequence. It's also recommended to use a capacitor to filter out any noise on the power supply lines.
  • The recommended clock frequency for the S34ML16G202TFI203 is up to 166 MHz, as specified in the datasheet. However, it's essential to consider the system's overall clock frequency, signal integrity, and noise tolerance when selecting the clock frequency.
  • The S34ML16G202TFI203 memory chip does not have built-in error correction or exception handling mechanisms. It's recommended to implement error detection and correction mechanisms, such as ECC (Error-Correcting Code) or CRC (Cyclic Redundancy Check), in the system's firmware or software to handle errors and exceptions during memory access.
  • The typical power consumption of the S34ML16G202TFI203 memory chip is around 350 mA during active operation, as specified in the datasheet. However, the actual power consumption may vary depending on the system's operating frequency, voltage, and usage patterns.

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