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S3G-TP - MCC

Description: Standard Recovery Rectifiers

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S3G-TP - MCC  - 3D model
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S3G-TP Details

  • Manufacturer Part Number:

    S3G-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DO-214AB

  • Package Description:

    SMCJ, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    3

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    10 µA

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

S3G-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It is crucial to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • To handle ESD protection for the S3G-TP, it is recommended to follow proper ESD handling procedures during assembly and testing, use ESD-protective packaging and materials, and consider adding external ESD protection devices such as TVS diodes or ESD arrays.
  • The recommended storage and handling procedures for the S3G-TP include storing the devices in their original packaging, avoiding exposure to moisture and extreme temperatures, and handling the devices by the body or leads to prevent damage.

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S3G-TP Overview

Use the download button to access the S3G-TP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like S3G-T, or try a keyword search, such as Rectifier Diodes

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Part Image S3G-E3/9AT Vishay Semiconductors

DIODE 3 A, 400 V, SILICON, RECTIFIER DIODE, DO-214AB, ROHS COMPLIANT, PLASTIC, SMC, 2 PIN, Rectifier Diode

Part Image S3G-HE3/9AT Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 3A, 400V V(RRM), Silicon, DO-214AB

Part Image S3GM6G Taiwan Semiconductor

Rectifier Diode, Schottky, 1 Phase, 1 Element, 3A, 400V V(RRM), Silicon, DO-214AB

Part Image S3GR6G Taiwan Semiconductor

Rectifier Diode, Schottky, 1 Phase, 1 Element, 3A, 400V V(RRM), Silicon, DO-214AB

Part Image S3G-HE3/57T Vishay Semiconductors

DIODE 3 A, 400 V, SILICON, RECTIFIER DIODE, DO-214AB, ROHS COMPLIANT, PLASTIC, SMC, 2 PIN, Rectifier Diode

For a full list of alternate parts for S3G-TP, check out Findchips.com