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S3JBHE3-TP - MCC

Description: Diode 600 V 3A Surface Mount DO-214AA (SMB)

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PCB Footprints
S3JBHE3-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMB (DO-214AA)
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3D Models
S3JBHE3-TP - MCC  - 3D model - Diodes Moulded - SMB (DO-214AA)
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S3JBHE3-TP Details

  • Manufacturer Part Number:

    S3JBHE3-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    600 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.15 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

S3JBHE3-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the S3JBHE3-TP is a rectangular pad with dimensions of 1.5mm x 0.8mm, with a 0.3mm diameter hole in the center for the thermal pad.
  • To ensure proper thermal management, it is recommended to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and to design the PCB with a solid copper plane underneath the device to dissipate heat effectively.
  • The maximum operating temperature range for the S3JBHE3-TP is -40°C to 125°C, with a maximum junction temperature of 150°C.
  • Yes, the S3JBHE3-TP is qualified to AEC-Q101 standards, making it suitable for use in high-reliability and automotive applications.
  • The S3JBHE3-TP has an integrated ESD protection diode, but it is still recommended to follow proper ESD handling procedures during assembly and testing, such as using an ESD wrist strap or mat.

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S3JBHE3-TP Overview

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