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S3MB - Taiwan Semiconductor

Description: Rectifiers 3A,1000V,GLASS Pass SMB Rect

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PCB Footprints
S3MB - Taiwan Semiconductor PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AA (SMB)_1
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3D Models
S3MB - Taiwan Semiconductor  - 3D model - Diodes Moulded - DO-214AA (SMB)_1
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S3MB Details

  • Manufacturer Part Number:

    S3MB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.15 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    1.5 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

S3MB Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the S3MB package, using a solid ground plane, and keeping the thermal traces as short and wide as possible. Additionally, it's recommended to use a thermal pad on the bottom of the package to improve heat dissipation.
  • The S3MB requires a specific power sequencing order to prevent damage to the device. The recommended power-up sequence is VDDIO, VDD, and then VREF. The power-down sequence should be reversed. It's also important to ensure that the voltage rails are stable and within the recommended operating range before applying power to the S3MB.
  • The S3MB is a sensitive device and requires proper ESD protection during handling and assembly. It's recommended to use an ESD wrist strap or mat, and to handle the device by the package body instead of the pins. Additionally, the device should be stored in an anti-static bag or tube when not in use.
  • To optimize the S3MB's performance for high-frequency applications, it's recommended to use a low-ESR capacitor for decoupling, keep the signal traces as short as possible, and use a high-frequency-compatible PCB material. Additionally, the device's internal clock frequency can be adjusted to optimize performance for specific applications.
  • The S3MB generates heat during operation, and proper thermal design and heat sinking are critical to ensure reliable operation. It's recommended to use a heat sink with a thermal interface material, and to ensure good airflow around the device. The thermal design should also take into account the device's power consumption and operating temperature range.

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S3MB Overview

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