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S3MB - onsemi

Description: High Surge Current Capacity; Glass Passivated Chip Junction; MSL 1 per J-STD-020; UL Flammability 94V-0 Classification; RoHS Compliant / Green Molding Compound; Low Forward Voltage: 1.15 V Maximum; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
S3MB - onsemi PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - DO-214AA_
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3D Models
S3MB - onsemi  - 3D model - Diodes Moulded Non Polarised - DO-214AA_
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S3MB Details

  • Manufacturer Part Number:

    S3MB

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Manufacturer Package Code:

    403AF

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.15 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    1.5 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

S3MB Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for S3MB is -40°C to 125°C.
  • To ensure reliable operation in high-humidity environments, it is recommended to use a moisture-resistant coating or conformal coating on the device, and to follow proper handling and storage procedures.
  • The recommended PCB layout for S3MB involves using a thermal pad and thermal vias to dissipate heat, and placing the device near a thermal ground plane. A heat sink or thermal interface material may also be used to improve thermal performance.
  • To handle ESD protection for S3MB, it is recommended to use ESD protection devices such as TVS diodes or ESD arrays, and to follow proper handling and storage procedures to prevent ESD damage.
  • The recommended soldering and rework conditions for S3MB involve using a soldering iron with a temperature of 260°C to 280°C, and a soldering time of 3 to 5 seconds. Rework should be done using a hot air rework station with a temperature of 220°C to 240°C.

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S3MB Overview

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