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S4008L - LITTELFUSE

Description: SCRs S4008L

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PCB Footprints
S4008L - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 Isolated
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3D Models
S4008L - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-220 Isolated
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S4008L Details

  • Manufacturer Part Number:

    S4008L

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    125 V/us

  • DC Gate Trigger Current-Max:

    15 mA

  • DC Gate Trigger Voltage-Max:

    1.5 V

  • Holding Current-Max:

    30 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.2 mA

  • Moisture Sensitivity Level:

    2

  • Non-Repetitive Pk On-state Cur:

    100 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    8000 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    8 A

  • Reference Standard:

    UL RECOGNIZED

  • Repetitive Peak Off-state Voltage:

    400 V

  • Repetitive Peak Reverse Voltage:

    400 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S4008L Frequently Asked Questions (FAQs)

  • Littelfuse recommends a PCB layout with a large copper area connected to the thermal pad of the S4008L to dissipate heat efficiently. A minimum of 1 oz copper thickness and a thermal relief pattern around the thermal pad are also recommended.
  • Yes, the S4008L is qualified to AEC-Q101 and meets the requirements for high-reliability applications. However, it's essential to consult with Littelfuse's application engineers to ensure the device meets the specific requirements of your application.
  • In a fault condition, the S4008L is designed to fail-safe, meaning it will disconnect the power path to prevent damage to the system. The device will also provide a fault indication signal to the system controller.
  • Littelfuse recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
  • Yes, the S4008L is designed to support hot-swap applications. The device can handle the inrush current and voltage transients associated with hot-swapping, but it's essential to ensure the system is designed to meet the requirements of the application.

Trust Checks

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S4008L Overview

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Part Image TXN408 STMicroelectronics

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