Littelfuse recommends a PCB layout with a large copper area connected to the thermal tab to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
To ensure reliable soldering, Littelfuse recommends using a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 180°C to 190°C. The component should be soldered within 3 seconds to 5 seconds, and the solder joints should be inspected for proper wetting and filleting.
The S402ESAP has a maximum surge current rating of 100 A, which is specified for a single pulse of 10 ms duration. However, it's essential to note that the device can handle higher surge currents for shorter durations, and the actual surge current rating may vary depending on the application and operating conditions.
While the S402ESAP is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, the device's performance may degrade at higher frequencies due to internal capacitance and inductance. It's recommended to consult with Littelfuse's application engineers for specific guidance on high-frequency applications.
Littelfuse recommends storing the S402ESAP in its original packaging or in a dry, clean environment with a temperature range of -40°C to 30°C and relative humidity below 60%. The devices should be handled with care to avoid mechanical stress, and electrostatic discharge (ESD) precautions should be taken to prevent damage.
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S402ESAP Overview
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