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S4055MTP - LITTELFUSE

Description: SCR 400 V 55 A Standard Recovery Through Hole TO-218 Non-Isolated Tab

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PCB Footprints
S4055MTP - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-218AC (M Package)
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3D Models
S4055MTP - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-218AC (M Package)
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S4055MTP Details

  • Manufacturer Part Number:

    S4055MTP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-218AC

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    550 V/us

  • DC Gate Trigger Current-Max:

    40 mA

  • DC Gate Trigger Voltage-Max:

    1.5 V

  • Holding Current-Max:

    60 mA

  • JEDEC-95 Code:

    TO-218AC

  • JESD-30 Code:

    R-PSFM-D3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Non-Repetitive Pk On-state Cur:

    650 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    35000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    55 A

  • Repetitive Peak Off-state Voltage:

    400 V

  • Repetitive Peak Reverse Voltage:

    400 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    SOLDER LUG

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S4055MTP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the S4055MTP is a rectangular pad with a size of 1.5mm x 0.8mm, with a 0.5mm radius corner. The pad should be centered on the component and have a solder mask defined (SMD) pad shape.
  • To ensure reliable soldering of the S4055MTP, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum operating temperature range for the S4055MTP is -55°C to 150°C. However, the device is typically specified for operation from -40°C to 125°C.
  • Yes, the S4055MTP is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its high-quality construction and rigorous testing.
  • To handle the S4055MTP for optimal performance, avoid touching the component's leads or body, as the oils from human skin can cause electrical leakage. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage.

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S4055MTP Overview

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