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S40FC016C1B1C01300 - SkyHigh Memory

Description: 153-ball VFBGA — 13 mm x 11.5 mm x 0.8 mm

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S40FC016C1B1C01300 - SkyHigh Memory PCB footprint - BGA - BGA - VFBGA 153_(H=0.8mm)
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S40FC016C1B1C01300 - SkyHigh Memory  - 3D model - BGA - VFBGA 153_(H=0.8mm)
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S40FC016C1B1C01300 Details

  • Manufacturer Part Number:

    S40FC016C1B1C01300

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    FBGA-153

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2020-03-11

  • Manufacturer:

    SkyHigh Memory Limited

  • Clock Frequency-Max (fCLK):

    200 MHz

  • JESD-30 Code:

    R-PBGA-B153

  • Length:

    13 mm

  • Memory Density:

    137438953472 bit

  • Memory IC Type:

    eMMC

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    153

  • Number of Words:

    17179869184 words

  • Number of Words Code:

    16000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Organization:

    16GX8

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA153,14X14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    EMMC 5.1

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Type:

    MLC NAND TYPE

  • Width:

    11.5 mm

  • Write Protection:

    SOFTWARE

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