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S5MB-13 - Diodes Incorporated

Description: Rectifiers Standard Recovery Rectifier SMB T&R 3K

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PCB Footprints
S5MB-13 - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - SMB
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S5MB-13 - Diodes Incorporated  - 3D model - Diodes Moulded - SMB
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S5MB-13 Details

  • Manufacturer Part Number:

    S5MB-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-08-25

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    1000 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.15 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

S5MB-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the S5MB-13 should consider the following: keep the input and output traces short and separate, use a solid ground plane, and place the device close to the power source. Additionally, ensure that the PCB is designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI).
  • To ensure proper soldering and mounting, follow these guidelines: use a soldering iron with a temperature range of 250°C to 260°C, apply a small amount of solder paste to the pads, and use a reflow oven or hot air gun to solder the device. Make sure the device is properly aligned and seated on the PCB before soldering.
  • The S5MB-13 has a high power density, so thermal management is crucial. Ensure good airflow around the device, use a heat sink if necessary, and design the PCB to dissipate heat efficiently. The device's thermal pad should be connected to a solid ground plane or a thermal via to improve heat dissipation.
  • While the S5MB-13 is a high-performance device, it may not be suitable for high-reliability or automotive applications without additional testing and validation. Engineers should consult with Diodes Incorporated or a qualified reliability expert to determine the device's suitability for such applications.
  • To troubleshoot issues with the S5MB-13, follow these steps: check the PCB layout and design for errors, verify the input and output voltage levels, ensure proper soldering and mounting, and use a thermal camera or thermometer to monitor the device's temperature. If issues persist, consult the datasheet or contact Diodes Incorporated's technical support.

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