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S6008L - LITTELFUSE

Description: SCRs 8A 600V

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PCB Footprints
S6008L - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB (L-Package) *
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3D Models
S6008L - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-220AB (L-Package) *
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S6008L Details

  • Manufacturer Part Number:

    S6008L

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    110 V/us

  • DC Gate Trigger Current-Max:

    15 mA

  • DC Gate Trigger Voltage-Max:

    1.5 V

  • Holding Current-Max:

    30 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.2 mA

  • Moisture Sensitivity Level:

    2

  • Non-Repetitive Pk On-state Cur:

    100 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    8000 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    8 A

  • Reference Standard:

    UL RECOGNIZED

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Trigger Device Type:

    SCR

S6008L Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the S6008L is a rectangular pad with a minimum size of 1.5mm x 0.8mm, with a 0.5mm diameter hole in the center for the thermal tab.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pads. Avoid applying excessive heat or pressure, which can damage the device.
  • The maximum allowed voltage drop across the S6008L is 1.5V, as specified in the datasheet. Exceeding this voltage drop may reduce the device's reliability and lifespan.
  • The S6008L is rated for operation up to 150°C, but it's recommended to derate the device's current handling capability at higher temperatures. Consult the datasheet for specific derating guidelines.
  • To protect the S6008L from EOS, use a TVS (transient voltage suppressor) diode or a varistor in parallel with the device, and ensure that the PCB layout provides a low-impedance path to ground for surge currents.

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S6008L Overview

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