Littelfuse recommends a thermal pad on the bottom of the device, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
Littelfuse recommends using a soldering iron with a temperature of 250°C to 260°C, and a solder with a melting point of 180°C to 190°C. The device should be soldered within 3 seconds to 5 seconds, and the solder joints should be inspected for proper wetting and filleting.
The S6016R has a maximum surge current rating of 100 A, 8/20 μs waveform, as per IEC 61000-4-5. This rating is in addition to the device's continuous current rating of 16 A.
Yes, the S6016R is suitable for high-frequency applications up to 100 kHz. However, the device's impedance and insertion loss should be considered in the design, and the application should be evaluated for potential resonance and oscillation.
The S6016R is designed to clamp overvoltages up to 500 V, and it will not fail short in overvoltage conditions. However, repeated overvoltage events may affect the device's long-term reliability and lifespan.
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S6016R Overview
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