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S6X8BSRP - LITTELFUSE

Description: Littelfuse, S6X8BSRP, Thyristor, 600V 0.8A, 200μA 3-Pin, SOT-89

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PCB Footprints
S6X8BSRP - LITTELFUSE PCB footprint - Other - Other - SOT-89
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3D Models
S6X8BSRP - LITTELFUSE  - 3D model - Other - SOT-89
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S6X8BSRP Details

  • Manufacturer Part Number:

    S6X8BSRP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.48

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    75 V/us

  • DC Gate Trigger Current-Max:

    0.2 mA

  • DC Gate Trigger Voltage-Max:

    0.8 V

  • Holding Current-Max:

    5 mA

  • JESD-30 Code:

    R-PSSO-F3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.5 mA

  • Non-Repetitive Pk On-state Cur:

    10 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    800 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    0.8 A

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S6X8BSRP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the S6X8BSRP is a rectangular pad with a minimum size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
  • Yes, the S6X8BSRP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the device.
  • The S6X8BSRP has a maximum surge current rating of 100A, which is the maximum current the device can withstand for a short duration (typically 8/20μs) without damage.
  • Yes, multiple S6X8BSRP devices can be used in parallel to increase the current rating, but it's essential to ensure that the devices are properly matched and that the PCB design takes into account the increased current and thermal requirements.

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S6X8BSRP Overview

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