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S70FL01GSAGBHBC10 - Infineon

Description: NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 8ns Automotive 24-Pin BGA Tray

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S70FL01GSAGBHBC10 - Infineon PCB footprint - BGA - BGA - 24-Ball BGA 8 x 6 mm (ZSA024)
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S70FL01GSAGBHBC10 - Infineon  - 3D model - BGA - 24-Ball BGA 8 x 6 mm (ZSA024)
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S70FL01GSAGBHBC10 Details

  • Manufacturer Part Number:

    S70FL01GSAGBHBC10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    QSPI

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Type:

    NOR TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

S70FL01GSAGBHBC10 Frequently Asked Questions (FAQs)

  • Infineon provides a dedicated application note (AN215) that outlines the recommended PCB layout and design guidelines for the S70FL01GSAGBHBC10. It covers topics such as signal integrity, power supply decoupling, and thermal management.
  • Infineon offers a Secure Boot Solution (SBS) for the S70FL01GSAGBHBC10, which provides a secure boot mechanism and firmware update capabilities. The SBS is based on the Trusted Execution Environment (TEE) and is supported by Infineon's software development kit (SDK).
  • The S70FL01GSAGBHBC10 has a maximum junction temperature (Tj) of 125°C. To ensure reliable operation, it's essential to implement proper thermal management, such as using thermal pads, heat sinks, or thermal interfaces. Infineon provides thermal design guidelines and recommends using thermal simulation tools to optimize the design.
  • Infineon offers a range of debugging tools, including the Infineon Debug Engine (IDE), which provides a comprehensive development environment for debugging and testing. Additionally, Infineon recommends using oscilloscopes, logic analyzers, and other specialized tools to troubleshoot issues with the S70FL01GSAGBHBC10.
  • The S70FL01GSAGBHBC10 requires a stable power supply with a voltage range of 1.7V to 1.95V. Infineon recommends using a low-dropout regulator (LDO) or a switching regulator with a high power supply rejection ratio (PSRR) to ensure reliable operation. The datasheet provides detailed power supply requirements and recommendations.

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