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S70FL01GSAGMFB010 - Infineon

Description: NOR Flash Nor

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S70FL01GSAGMFB010 - Infineon - PCB symbol
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S70FL01GSAGMFB010 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead SOIC
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S70FL01GSAGMFB010 - Infineon - 3D model - Small Outline Packages - 16-Lead SOIC
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S70FL01GSAGMFB010 Details

  • Manufacturer Part Number:

    S70FL01GSAGMFB010

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Serial Bus Type:

    SPI

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    7.5 mm

  • Write Protection:

    HARDWARE/SOFTWARE

S70FL01GSAGMFB010 Frequently Asked Questions (FAQs)

  • Infineon provides a dedicated application note (AN2015-01) that outlines the recommended PCB layout and design guidelines for the S70FL01GSAGMFB010. It covers topics such as signal integrity, power supply decoupling, and thermal management.
  • Infineon provides a Secure Boot Solution (SBS) for the S70FL01GSAGMFB010, which includes a set of tools and guidelines for implementing secure boot and firmware updates. Additionally, the company offers a Firmware Over-the-Air (FOTA) update solution for secure and efficient firmware updates.
  • The S70FL01GSAGMFB010 has a maximum junction temperature (Tj) of 125°C. To ensure reliable operation, it's essential to implement proper thermal management, such as using thermal pads, heat sinks, or thermal interfaces. Infineon provides thermal simulation models and guidelines to help designers optimize their thermal design.
  • Infineon offers a range of tools and resources for debugging and troubleshooting the S70FL01GSAGMFB010, including the Infineon Toolbox, which provides a set of software tools for debugging, testing, and programming. Additionally, the company offers a dedicated support portal with FAQs, application notes, and technical documentation.
  • Infineon recommends following the IPC-CC-830B standard for conformal coating and potting compounds when using the S70FL01GSAGMFB010 in harsh environments. The company also provides guidelines for selecting suitable coating materials and application processes to ensure the device's reliability and performance.

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S70FL01GSAGMFB010 Overview

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