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S70FL01GSDPBHIC10 - Infineon

Description: NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 8ns 24-Pin BGA Tray

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S70FL01GSDPBHIC10 - Infineon PCB footprint - BGA - BGA - 24-Ball BGA 8 x 6 mm (ZSA024)
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S70FL01GSDPBHIC10 - Infineon  - 3D model - BGA - 24-Ball BGA 8 x 6 mm (ZSA024)
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S70FL01GSDPBHIC10 Details

  • Manufacturer Part Number:

    S70FL01GSDPBHIC10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Clock Frequency-Max (fCLK):

    66 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.0002 A

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Type:

    NOR TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

S70FL01GSDPBHIC10 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide for the S70FL01GSDPBHIC10, which includes recommendations for PCB layout, thermal management, and decoupling. It's essential to follow these guidelines to ensure optimal performance, reliability, and thermal stability.
  • Infineon provides a Secure Boot Solution (SBS) for the S70FL01GSDPBHIC10, which includes a set of tools and guidelines for implementing secure boot and firmware updates. Additionally, Infineon recommends using a secure boot loader and encryption mechanisms to protect the firmware and data.
  • The S70FL01GSDPBHIC10 has an internal POR and BOD circuitry. The POR threshold is typically around 1.7V, and the BOD threshold is around 2.2V. However, it's recommended to consult the device's errata sheet and application notes for specific requirements and implementation guidelines.
  • To optimize power consumption, it's essential to use the device's power-saving features, such as the low-power modes (e.g., sleep, deep sleep, and power-down modes). Additionally, optimizing the clock frequency, using dynamic voltage and frequency scaling, and minimizing peripheral usage can help reduce power consumption.
  • The S70FL01GSDPBHIC10's ADC has limitations on sampling rate, resolution, and input range. It's essential to consult the datasheet and application notes for specific guidelines on ADC usage, including input impedance, sampling frequency, and noise reduction techniques.

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Part Image S70FL01GSDPBHIC10 Cypress Semiconductor

Flash, 128MX8, PBGA24