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S70FL01GSDPMFI010 - Infineon

Description: Flash Memory Nor

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S70FL01GSDPMFI010 - Infineon - PCB symbol
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S70FL01GSDPMFI010 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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S70FL01GSDPMFI010 - Infineon - 3D model - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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S70FL01GSDPMFI010 Details

  • Manufacturer Part Number:

    S70FL01GSDPMFI010

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Clock Frequency-Max (fCLK):

    66 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.0002 A

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    7.5 mm

  • Write Protection:

    HARDWARE/SOFTWARE

S70FL01GSDPMFI010 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN2013-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The S70FL01GSDPMFI010 has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, the device's thermal resistance (RthJA) is specified in the datasheet, and a thermal analysis should be performed to ensure the device operates within its recommended temperature range.
  • The S70FL01GSDPMFI010 requires a single 3.3V power supply with a recommended operating range of 3.0V to 3.6V. The power supply should be decoupled with a 10uF capacitor and a 1uF capacitor in parallel to ensure stable operation. Additionally, the power supply should be able to provide a minimum of 100mA of current to support the device's operating current.
  • The S70FL01GSDPMFI010 has built-in ESD protection, but additional external protection may be required depending on the application. Infineon recommends using a TVS (Transient Voltage Suppressor) diode or a dedicated ESD protection IC to protect the device from electrostatic discharge.
  • The S70FL01GSDPMFI010 requires a clock signal with a frequency range of 100MHz to 200MHz. The clock signal should have a duty cycle of 50% and a rise/fall time of less than 1ns. Additionally, the clock signal should be decoupled with a 10pF capacitor to ensure stable operation.

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S70FL01GSDPMFI010 Overview

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