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S70FS01GSAGBHI210 - Infineon

Description: FLASH - NOR Memory IC 1Gbit SPI - Quad I/O 133 MHz 24-BGA (8x6)

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S70FS01GSAGBHI210 - Infineon PCB footprint - BGA - BGA - 24-ball FBGA 8.0 x 6.0 X 1.2 mm (ZSA024)
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S70FS01GSAGBHI210 - Infineon  - 3D model - BGA - 24-ball FBGA 8.0 x 6.0 X 1.2 mm (ZSA024)
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S70FS01GSAGBHI210 Details

  • Manufacturer Part Number:

    S70FS01GSAGBHI210

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Additional Feature:

    IT ALSO HAVE MEMORY WIDTH X1

  • Alternate Memory Width:

    2

  • Clock Frequency-Max (fCLK):

    133 MHz

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    4

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX4

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    1.8 V

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

S70FS01GSAGBHI210 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide and thermal design guidelines in their application notes and layout recommendations. It's essential to follow these guidelines to ensure optimal performance, thermal management, and to prevent thermal throttling.
  • Infineon provides a Secure Boot Solution (SBS) and a Firmware Over-the-Air (FOTA) update mechanism. Engineers can use the Infineon's Secure Boot Kit and FOTA library to implement secure boot and firmware updates. Additionally, they can consult the Infineon's security guidelines and application notes for more information.
  • The S70FS01GSAGBHI210 has various power modes, including sleep, deep sleep, and shutdown. Engineers can use the Infineon's power management API and consult the datasheet to understand the power consumption in different modes. They can also implement power-saving techniques, such as clock gating and voltage scaling, to optimize power consumption.
  • The S70FS01GSAGBHI210 has various interfaces, including SPI, I2C, UART, and GPIO. Engineers can use the Infineon's peripheral driver libraries and consult the datasheet to understand the interface protocols and pin configurations. They can also use external peripheral libraries and drivers provided by the peripheral manufacturers.
  • Infineon provides a range of debugging and testing tools, including the Infineon's DAVE (Digital Application Virtual Engineer) development environment, the Infineon's XMC4500 Relax Kit, and third-party tools like Keil µVision and IAR Embedded Workbench. Engineers can use these tools to debug, test, and optimize their firmware.

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S70FS01GSAGBHI210 Overview

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Part Image S70FS01GSAGBHI210 Cypress Semiconductor

Flash, 256MX4, PBGA24